The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2020

Filed:

Aug. 07, 2014
Applicant:

Sikorsky Aircraft Corporation, Stratford, CT (US);

Inventor:

David A. Darrow, Jr., Stratford, CT (US);

Assignee:

SIKORSKY AIRCRAFT CORPORATION, Stratford, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F01D 5/14 (2006.01); B29D 99/00 (2010.01); B29C 70/20 (2006.01); B29C 70/30 (2006.01); B29K 105/10 (2006.01); B29K 307/04 (2006.01); B29L 31/08 (2006.01); B29K 63/00 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
F01D 5/147 (2013.01); B29C 70/20 (2013.01); B29C 70/30 (2013.01); B29D 99/0025 (2013.01); B29K 2063/00 (2013.01); B29K 2105/106 (2013.01); B29K 2105/253 (2013.01); B29K 2307/04 (2013.01); B29K 2995/0082 (2013.01); B29L 2031/082 (2013.01);
Abstract

A composite spar having an upper and lower wall region connected by leading and trailing edge regions is provided including a plurality of first laminates and a plurality of second laminates. The plurality of first laminates includes one or more intermediate modulus graphite plies having an intermediate modulus. The plurality of first laminates is arranged in one or more intermediate modulus layers to form at least a portion of the upper wall region, lower wall region, leading edge region and trailing edge region. The plurality of second laminates includes one or more high modulus graphite plies having a high modulus. The plurality of second laminates is arranged in one or more high modulus layers. The high modulus layers are generally interposed between intermediate modulus layers.


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