The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2020
Filed:
Feb. 09, 2016
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Akita University, Akita-shi, JP;
Tsuchiya Co., Ltd., Nagoya-shi, Aichi, JP;
Toshiyuki Takayanagi, Tokyo, JP;
Naomoto Ishikawa, Tokyo, JP;
Hideki Horizono, Tokyo, JP;
Nobuyuki Kamihara, Tokyo, JP;
Mikio Muraoka, Akita, JP;
Hiroaki Hayashi, Aichi, JP;
Osamu Yoshida, Aichi, JP;
Kotaro Tsuji, Aichi, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
AKITA UNIVERSITY, Akita-Shi, Akita, JP;
TSUCHIYA CO., LTD., Nagoya-Shi, Aichi, JP;
Abstract
Provided is an adhesive that can provide quick bonding between thermoplastic resins and excellent bond strength, a structure having adhesion provided by the adhesive, and an adhesion method using the adhesive. The adhesive bonds a first member () containing a thermoplastic resin or a carbon fiber reinforced thermoplastic resin and a second member () containing the thermoplastic resin or the carbon fiber reinforced thermoplastic resin. The adhesive includes a thermoplastic resin as a main component containing a metal nano material that absorbs electromagnetic waves and generates heat.