The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2020

Filed:

Mar. 30, 2016
Applicant:

Toho Tenax Co., Ltd., Tokyo, JP;

Inventors:

Toru Kaneko, Tokyo, JP;

Yuko Okano, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/24 (2006.01); B32B 3/12 (2006.01); B32B 5/24 (2006.01); B32B 27/18 (2006.01); B32B 27/20 (2006.01); B32B 27/26 (2006.01); B32B 27/38 (2006.01); C08L 63/00 (2006.01); C08L 33/10 (2006.01); C08L 101/00 (2006.01); C08G 59/40 (2006.01); B29C 43/02 (2006.01); C08K 5/21 (2006.01); C08K 5/315 (2006.01); B29C 43/12 (2006.01); B32B 37/10 (2006.01); B29C 70/34 (2006.01); B29K 105/08 (2006.01); B29K 307/04 (2006.01); B29K 663/00 (2006.01); B29L 9/00 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); B29C 43/02 (2013.01); B29C 43/12 (2013.01); B29C 70/342 (2013.01); B32B 3/12 (2013.01); B32B 5/245 (2013.01); B32B 37/10 (2013.01); C08G 59/40 (2013.01); C08J 5/24 (2013.01); C08K 5/21 (2013.01); C08K 5/315 (2013.01); C08L 33/10 (2013.01); C08L 101/00 (2013.01); B29K 2105/0881 (2013.01); B29K 2307/04 (2013.01); B29K 2663/00 (2013.01); B29L 2009/00 (2013.01); C08J 2363/00 (2013.01); C08J 2433/10 (2013.01); C08J 2477/00 (2013.01); C08J 2481/06 (2013.01); C08L 2205/02 (2013.01); C08L 2205/035 (2013.01);
Abstract

The present invention provides an epoxy resin composition comprising at least the following component [A], component [B] and component [C], the epoxy resin composition being characterized in that: the mixture of component [A] and component [B] is a mixture that, when temperature is increased at 2° C./min, begins to thicken at temperature (T) and completes thickening at temperature (T), temperature (T) being 80-110° C. and temperature (T) and temperature (T) satisfying the relationship of expression (1) 5° C.≤(T−T)≤20° C. expression (1); and the mixture of component [A] and component [C] is a mixture that, when temperature is increased at 2° C./min, begins to cure at temperature (T), temperature (T) and temperature (T) satisfying the relationship of expression (2) 5° C.≤(T−T)≤80° C. expression (2).


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