The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2020

Filed:

Dec. 08, 2016
Applicant:

General Mills, Inc., Minneapolis, MN (US);

Inventors:

George A Tuszkiewicz, Plymouth, MN (US);

David W Jordan, Big Lake, MN (US);

Thomas Miller, Maple Grove, MN (US);

Peter L Novotny, Crystal, MN (US);

Jenna M Ronquillo, Woodbury, MN (US);

Assignee:

General Mills, Inc., Minneapolis, MN (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/00 (2006.01); B31F 5/00 (2006.01); B29C 65/08 (2006.01);
U.S. Cl.
CPC ...
B31F 5/008 (2013.01); B29C 65/08 (2013.01);
Abstract

In a method of ultrasonically bonding paperboard, first and second pieces of paperboard are supplied, with at least one of the first and second pieces of paperboard being provided with a clay coating. The first and second pieces of paperboard are moistened and positioned in a gap between a sonotrode and an anvil of an ultrasonic welding unit. The ultrasonic welding unit is activated and the first and second pieces of paperboard are compressed between 30-70%, more preferably between 40-60%, to cause the clay coating to mobilize and force the clay coating material into fiber matrixes of the first and second pieces of paperboard, followed by cooling of the first and second pieces of paperboard, to bond the first and second pieces of paperboard.


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