The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2020
Filed:
Apr. 12, 2018
Martin Brokner Christiansen, Laurel, MD (US);
Stanley Katsuyoshi Wakamiya, Ellicott City, MD (US);
Elie K. Track, Stamford, CT (US);
Steven Ward Van Sciver, Easton, PA (US);
Kelsey Mccusker, Sparrows Point, MD (US);
Martin Brokner Christiansen, Laurel, MD (US);
Stanley Katsuyoshi Wakamiya, Ellicott City, MD (US);
Elie K. Track, Stamford, CT (US);
Steven Ward Van Sciver, Easton, PA (US);
Kelsey McCusker, Sparrows Point, MD (US);
NORTHROP GRUMMAN SYSTEMS CORPORATION, Falls Church, VA (US);
Abstract
An apparatus for providing forced flow cooling in a circuit card environment is provided includes at least one circuit card including first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, which are different from one another. A housing defines a housing internal volume which completely three-dimensionally surrounds the circuit card. A first temperature-control fluid is directed laterally across at least a portion of the first circuit card subassembly within the housing internal volume in a first flow path to induce the first operating temperature concurrently with a second temperature-control fluid being directed laterally across at least a portion of the second circuit card subassembly within the housing internal volume in a second flow path to induce the second operating temperature.