The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2020

Filed:

Feb. 25, 2019
Applicant:

Avl Technologies, Inc., Asheville, NC (US);

Inventors:

Ian J. Timmins, Seminole, FL (US);

Wayne Holt, Dacula, GA (US);

Alan Ellis, Candler, NC (US);

Adam C. Gropp, Candler, NC (US);

Keith Edenfield, Weaverville, NC (US);

Bruce Barratt, Asheville, NC (US);

Assignee:

AvL Technologies, Inc., Asheville, NC (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20163 (2013.01); H05K 7/20154 (2013.01); H05K 7/20536 (2013.01);
Abstract

A heatsink for heat dissipation amongst an active electronically steered array (AESA) on a printed circuit board (PCB) includes a metal plate having a first side and a second side; a plurality of integrally formed pockets on the first side of the metal plate each being sized and configured for congruent receipt of a corresponding one of a plurality of functional blocks of the AESA on the PCB; a plurality of waveguide manifolds on the second side of the metal plate including a plurality of holes that launch a wave transmission and a plurality of slots that guide the direction of the wave transmission; and wherein the metal plate prevents localized overheating amongst the AESA by positioning the metal plate on the PCB wherein the plurality of integrally formed pockets and the plurality of holes and the plurality of slots of the plurality of waveguide manifolds facilitate heat dissipation.


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