The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2020
Filed:
Apr. 21, 2015
Applicant:
Cornell University, Ithaca, NY (US);
Inventors:
Robert MacCurdy, Ithaca, NY (US);
Hod Lipson, New York, NY (US);
Assignee:
Cornell University, Ithaca, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/28 (2006.01); H01L 27/13 (2006.01); A61B 17/50 (2006.01); H01L 27/01 (2006.01); B29C 64/00 (2017.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 3/00 (2006.01); H05K 3/36 (2006.01); H05K 3/12 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 40/00 (2020.01); B33Y 80/00 (2015.01); B29C 65/16 (2006.01); H01L 21/56 (2006.01); H01L 21/67 (2006.01); H01L 23/538 (2006.01); H01L 25/11 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01); H05K 1/11 (2006.01); H05K 3/30 (2006.01); H05K 1/16 (2006.01); H05K 3/46 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); A61B 17/50 (2013.01); B29C 64/00 (2017.08); B29C 65/16 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B33Y 80/00 (2014.12); H01L 21/56 (2013.01); H01L 21/67115 (2013.01); H01L 21/67132 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 25/112 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 27/01 (2013.01); H01L 27/13 (2013.01); H05K 1/0287 (2013.01); H05K 1/115 (2013.01); H05K 1/14 (2013.01); H05K 3/0014 (2013.01); H05K 3/125 (2013.01); H05K 3/284 (2013.01); H05K 3/30 (2013.01); H05K 3/368 (2013.01); B29L 2031/34 (2013.01); H05K 1/113 (2013.01); H05K 1/117 (2013.01); H05K 1/16 (2013.01); H05K 3/4673 (2013.01); H05K 3/4697 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10053 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10174 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10636 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1327 (2013.01);
Abstract
A hybrid additive manufacturing approach that incorporates three-dimensional (3D) printing and placement of modules selected from a library of modules to fabricate an electromechanical assembly. By virtue of fabrication of the electromechanical assembly, mechanical properties and electrical properties of the assembly are created. The invention overcomes the material and process limitations of current printable electronics approaches, enabling complete, complex electromechanical assemblies to be fabricated.