The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2020

Filed:

Sep. 12, 2018
Applicant:

Carnegie Mellon University, Pittsburgh, PA (US);

Inventors:

Carmel Majidi, Pittsburgh, PA (US);

Michael D. Bartlett, Pittsburgh, PA (US);

Eric J. Markvicka, Pittsburgh, PA (US);

Assignee:

CARNEGIE MELLON UNIVERSITY, Pittsburgh, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/30 (2006.01); H05K 1/03 (2006.01); H05K 1/18 (2006.01); A61B 5/11 (2006.01); A61B 5/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0283 (2013.01); A61B 5/1123 (2013.01); A61B 5/6825 (2013.01); H05K 1/0393 (2013.01); H05K 1/189 (2013.01); H05K 3/0032 (2013.01); H05K 3/303 (2013.01); A61B 5/6832 (2013.01); A61B 2562/0261 (2013.01); A61B 2562/12 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/107 (2013.01); H05K 2203/166 (2013.01);
Abstract

Disclosed herein is an efficient fabrication approach to create highly customizable wearable electronics through rapid laser machining and adhesion-controlled soft materials assembly. Well-aligned, multi-layered materials can be created from 2D and 3D elements that stretch and bend while seamlessly integrating with rigid components such as microchip integrated circuits (IC), discrete electrical components, and interconnects. These techniques are applied using commercially available materials. These materials and methods enable custom wearable electronics while offering versatility in design and functionality for a variety of bio-monitoring applications.


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