The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2020
Filed:
Aug. 29, 2019
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
Hong Heng Sheng Electronical Technology (Huaian)co.,ltd., Huaian, CN;
Yong-Quan Yang, Qinhuangdao, CN;
Yong-Chao Wei, Qinhuangdao, CN;
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
Hong Heng Sheng Electronical Technology (HuaiAn)Co., Ltd., Huaian, CN;
Abstract
A high-frequency circuit board includes a first circuit structure, a second circuit structure, and a dielectric layer formed on the second circuit structure. The first circuit structure includes a first substrate layer and at least one first circuit layer. The at least one first circuit layer is formed on at least one surface of the first substrate layer. At least one receiving cavity is defined in the first substrate layer. A second circuit structure is embedded in the receiving cavity. The second circuit structure includes a second substrate layer, at least one second circuit layer embedded in the second substrate layer, and a plurality of support columns formed on the second substrate layer. A portion of the dielectric layer is filled into gaps between an inner wall of the receiving cavity and the second circuit structure. The support columns are embedded in the dielectric layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile