The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2020

Filed:

Sep. 12, 2018
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Hirokazu Yazaki, Nagaokakyo, JP;

Keito Yonemori, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01L 23/498 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01); H01F 27/40 (2006.01); H01G 4/30 (2006.01); H01G 4/40 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01); H03H 1/00 (2006.01); H03H 7/01 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0216 (2013.01); H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 27/40 (2013.01); H01G 4/30 (2013.01); H01G 4/40 (2013.01); H01L 23/49822 (2013.01); H05K 1/0233 (2013.01); H05K 1/116 (2013.01); H05K 1/181 (2013.01); H05K 1/186 (2013.01); H01F 2017/0026 (2013.01); H01F 2017/0066 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/19105 (2013.01); H03H 7/0115 (2013.01); H03H 2001/0085 (2013.01); H05K 3/4632 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10015 (2013.01);
Abstract

A composite component-embedded circuit board includes a circuit board including a first functional block disposed closer to an upper surface of the circuit board, and a second functional block different from the first functional block and disposed closer to a lower surface of the circuit board, and a composite chip circuit embedded in the circuit board and including first and second circuit elements. The composite component further includes first and second terminal electrodes. The first terminal electrode is disposed on an upper surface of the composite component. The first terminal electrode is connected to the composite circuit and to the first functional block. The second terminal electrode is disposed on a lower surface of the composite component. The second terminal electrode is connected to the composite circuit and to the second functional block.


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