The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2020
Filed:
Oct. 17, 2017
Hitachi Automotive Systems, Ltd., Ibaraki, JP;
Hitachi Automotive Systems, Ltd., Ibaraki, JP;
Abstract
A semiconductor module includes: a circuit board on which a first semiconductor chip and a second semiconductor chip are mounted and includes a first through hole formed with a conductor foil therein; a press-fit terminal that is electrically connected to the conductor foil in the first through hole of the circuit board; and a second resin that is disposed on a surface side and a back surface side of the circuit board. Further, the press-fit terminal is provided with a pressure contact portion which is press-fitted into the first through hole and is electrically connected to the conductor foil in the first through hole, and the second resin on the surface side of the circuit board and the second resin on the back surface side of the circuit board are integrally formed via a second resin that is filled in the first through hole.