The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2020

Filed:

Sep. 10, 2018
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Inventors:

Keiju Yamada, Yokohama, JP;

Makoto Sano, Kawasaki, JP;

Makoto Higaki, Setagaya, JP;

Koh Hashimoto, Yokohama, JP;

Assignee:

KABUSHIKI KAISHA TOSHIBA, Minato-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 13/10 (2006.01); H01Q 1/38 (2006.01); H01L 23/552 (2006.01); H01Q 1/22 (2006.01); H01L 21/56 (2006.01); H01Q 13/08 (2006.01); H01L 23/498 (2006.01); H01Q 13/16 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/38 (2013.01); H01L 21/561 (2013.01); H01L 23/49838 (2013.01); H01L 23/552 (2013.01); H01Q 1/2283 (2013.01); H01Q 13/08 (2013.01); H01Q 13/103 (2013.01); H01Q 13/16 (2013.01); H01L 23/3121 (2013.01);
Abstract

The wireless module according to an aspect of the present invention includes a board, a wireless communication chip that at least transmits or receives a high-frequency signal, an insulator, a conductive film, a feed line, first to third conductor patterns, and first and second vias. The chip, the feed line, and the first and second patterns are located on a first wiring layer of the board. The third pattern is at a ground potential and is located on a second wiring layer of the board. The insulator encapsulates the chip. The film covers at least a part of a side surface of the insulator. The feed line electrically connects the chip and the film. The first and second patterns are in contact with the film. The first via connects the first pattern and the third pattern. The second via electrically connects the second pattern and the third pattern.


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