The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2020

Filed:

Jan. 22, 2018
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventor:

Naoki Gouchi, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01); H05K 3/36 (2006.01); H05K 1/14 (2006.01); H05K 1/02 (2006.01); H01P 3/00 (2006.01); H01P 3/02 (2006.01); H01P 1/02 (2006.01); H01P 11/00 (2006.01);
U.S. Cl.
CPC ...
H01P 3/082 (2013.01); H01P 1/022 (2013.01); H01P 3/006 (2013.01); H01P 3/026 (2013.01); H01P 11/003 (2013.01); H05K 1/028 (2013.01); H05K 1/0245 (2013.01); H05K 1/0251 (2013.01); H05K 1/148 (2013.01); H05K 3/365 (2013.01); H05K 1/14 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/10189 (2013.01);
Abstract

A multilayer substrate includes an element assembly including stacked insulating layers and including at least a first insulating layer with a first principal surface and a second principal surface and a second insulating layer with a third principal surface and a fourth principal surface, a first conductor layer, and a second conductor layer. The second principal surface and the third principal surface are in contact with each other, and no planar or linear conductors are located on the second principal surface and the third principal surface. The first conductor layer is located on the first principal surface, and the second conductor layer is located on the fourth principal surface.


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