The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2020

Filed:

Mar. 20, 2019
Applicant:

Nanoco Technologies Ltd., Manchester, GB;

Inventors:

Imad Naasani, Manchester, GB;

Nigel Pickett, Manchester, GB;

Assignee:

Nanoco Technologies, Ltd., Manchester, GB;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); B82Y 20/00 (2011.01); C09K 11/02 (2006.01); C09K 11/56 (2006.01); C09K 11/88 (2006.01); H01L 33/06 (2010.01); H01L 33/52 (2010.01);
U.S. Cl.
CPC ...
H01L 33/504 (2013.01); B82Y 20/00 (2013.01); C09K 11/02 (2013.01); C09K 11/565 (2013.01); C09K 11/883 (2013.01); H01L 33/06 (2013.01); H01L 33/501 (2013.01); H01L 33/52 (2013.01); H01L 33/502 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0041 (2013.01);
Abstract

A light emitting layer including a plurality of light emitting particles embedded within a host matrix material. Each of said light emitting particles includes a population of semiconductor nanoparticles embedded within a polymeric encapsulation medium. A method of fabricating a light emitting layer comprising a plurality of light emitting particles embedded within a host matrix material, each of said light emitting particles comprising a population of semiconductor nanoparticles embedded within a polymeric encapsulation medium. The method comprises providing a dispersion containing said light emitting particles, depositing said dispersion to form a film, and processing said film to produce said light emitting layer.


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