The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2020

Filed:

Sep. 11, 2019
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventor:

Myung Cheol Yoo, Pleasanton, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/32 (2010.01); H01L 33/00 (2010.01); H01L 33/40 (2010.01); H01L 33/46 (2010.01); H01L 33/64 (2010.01); H01L 33/60 (2010.01); H01L 33/04 (2010.01); H01L 33/14 (2010.01); H01L 33/62 (2010.01); H01L 33/54 (2010.01); H01L 33/12 (2010.01); H01L 33/38 (2010.01); H01L 33/42 (2010.01);
U.S. Cl.
CPC ...
H01L 33/32 (2013.01); H01L 33/0079 (2013.01); H01L 33/04 (2013.01); H01L 33/14 (2013.01); H01L 33/405 (2013.01); H01L 33/46 (2013.01); H01L 33/54 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/647 (2013.01); H01L 33/007 (2013.01); H01L 33/0095 (2013.01); H01L 33/12 (2013.01); H01L 33/38 (2013.01); H01L 33/42 (2013.01); H01L 33/641 (2013.01);
Abstract

A vertical topology light emitting device can include a conductive support structure; an adhesion layer disposed on the conductive support structure; a p-type contact disposed on the adhesion layer; a GaN-based semiconductor structure disposed on the p-type contact, in which the GaN-based semiconductor structure includes an n-type GaN-based layer, a p-type GaN-based layer, and an active layer between the n-type GaN-based layer and the p-type GaN-based layer, in which the n-type GaN-based layer has an etched flat surface, and the GaN-based semiconductor structure includes a bottom surface proximate to the conductive support structure, a top surface opposite to the bottom surface, and a side surface between the top surface and the bottom surface; an interface layer on the GaN-based semiconductor structure; and a contact pad disposed on the interface layer, in which the interface layer includes a portion which directly contacts the etched flat surface of the n-type GaN-based layer, and a first thickness of the conductive support structure is 0.5 times less than a width of the top surface of the GaN-based semiconductor structure.


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