The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2020

Filed:

Aug. 29, 2018
Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventors:

Kazuki Yamaguchi, Tokushima, JP;

Haruki Takeda, Anan, JP;

Yoshitaka Sumitomo, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/301 (2006.01); B23K 26/53 (2014.01); B23K 26/08 (2014.01); B23K 26/40 (2014.01); H01L 21/263 (2006.01); H01L 21/268 (2006.01); H01L 33/00 (2010.01); H01L 21/67 (2006.01); B23K 26/364 (2014.01); H01L 21/78 (2006.01); B23K 26/0622 (2014.01); B23K 101/40 (2006.01); B23K 101/36 (2006.01);
U.S. Cl.
CPC ...
H01L 33/0095 (2013.01); B23K 26/0622 (2015.10); B23K 26/08 (2013.01); B23K 26/364 (2015.10); B23K 26/53 (2015.10); H01L 21/67092 (2013.01); H01L 21/67115 (2013.01); H01L 21/78 (2013.01); H01L 33/007 (2013.01); B23K 2101/36 (2018.08); B23K 2101/40 (2018.08);
Abstract

A method of manufacturing a light-emitting element includes: providing a wafer including: a substrate, and a semiconductor structure; forming a plurality of modified regions inside the substrate of the wafer by irradiating the substrate with a laser beam; and separating the wafer into a plurality of light-emitting elements after said irradiating the substrate with the laser beam. Said forming the plurality of modified regions includes: scanning the laser beam along a plurality of first lines, the plurality of first lines extending in a first direction and being arranged in a second direction, the first direction being parallel to the first surface, the second direction intersecting the first direction and being parallel to the first surface, and scanning the laser beam along a plurality of second lines, the plurality of second lines extending in the second direction and being arranged in the first direction.


Find Patent Forward Citations

Loading…