The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2020
Filed:
May. 15, 2018
Samsung Electronics Co., Ltd., Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package separating device is provided. The semiconductor package separating device includes a die configured to support a lead frame array including a fixing portion inserted into an insertion groove formed on at least a side surface of a semiconductor package to support the semiconductor package; and a cylindrical punch configured to rotate in a rotational direction, the cylindrical punch including a bending protrusion and a package separating protrusion that are provided on an outer circumferential surface of the cylindrical punch, the bending protrusion being configured to apply pressure to the fixing portion to bend the fixing portion, and the package separating protrusion being configured to apply pressure to the semiconductor package to separate the semiconductor package from the lead frame array in a state in which the fixing portion has been bent by the bending protrusion.