The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2020

Filed:

Oct. 19, 2016
Applicant:

Astrium Gmbh, Taufkirchen, DE;

Inventor:

Claus Zimmermann, München, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/05 (2014.01); H01L 27/142 (2014.01); H01L 31/0224 (2006.01); H01L 31/048 (2014.01); H01L 31/0687 (2012.01); H01L 31/0304 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0508 (2013.01); H01L 27/1421 (2013.01); H01L 31/022425 (2013.01); H01L 31/048 (2013.01); H01L 31/0504 (2013.01); H01L 31/0516 (2013.01); H01L 31/0687 (2013.01); H01L 31/0304 (2013.01); Y02E 10/50 (2013.01); Y02P 70/521 (2015.11);
Abstract

Solar cell assembly that includes at least first and second solar cells arranged adjacent each other to form a row. First electric contact pad of first solar cell is positioned adjacent to second electric contact pad of second solar cell and second electric contact pad of first solar cell is positioned adjacent to first electric contact pad of second solar cell. Interconnectors connect each first electric contact pad of first solar cell with adjacent second electric contact pad of second solar cell and each second electric contact pad of first solar cell with adjacent first electric contact pad of second solar cell. Each interconnector is sized so that, between adjacent cells, interconnector is below first electric contact pad. Cover glass is provided on a front surface of each solar cell, and each interconnector is provided with a cover member covering a front surface of interconnector.


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