The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2020

Filed:

May. 31, 2018
Applicant:

National Research Council of Canada, Ottawa, CA;

Inventors:

Zhiyi Zhang, Ottawa, CA;

Ye Tao, Orleans, CA;

Heping Ding, Ottawa, CA;

Salima Alem, Ottawa, CA;

Shoude Chang, Ottawa, CA;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/144 (2006.01); H01L 31/0224 (2006.01); H01L 31/0256 (2006.01); H01L 27/146 (2006.01); H01L 31/18 (2006.01); G09G 3/3216 (2016.01);
U.S. Cl.
CPC ...
H01L 27/1446 (2013.01); H01L 31/0224 (2013.01); H01L 31/0256 (2013.01); H01L 31/18 (2013.01); G09G 3/3216 (2013.01); H01L 27/14643 (2013.01);
Abstract

Methods are provided for fabricating photodetector arrays using passive matrix addressing technology. The photodetector arrays use a pair of switching diode and photo diode to overcome crosstalk issues within the passive matrix. The switching diode and the photo diode of each pixel may be connected using a cathode-to-cathode connection, or an anode-to-anode connection. The photodetector arrays are fabricated by assembling on a first substrate, an array of photodetector pixels comprising a switching diode and a photo diode, providing conductive lines for each row of the array and conductive lines for each column of the array, and attaching a second substrate to the first substrate. The photodetector array may also be fabricated by assembling on a first substrate an array of switching diodes, and assembling on a second substrate an array of photo diodes, and bonding the first and second substrates together.


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