The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2020
Filed:
Mar. 26, 2018
Boe Technology Group Co., Ltd., Beijing, CN;
Chengdu Boe Optoelectronics Technology Co., Ltd., Chengdu, CN;
Lei Su, Beijing, CN;
Xiaofei Yang, Beijing, CN;
Xu Liu, Beijing, CN;
Xun Mou, Beijing, CN;
Yawen Zhu, Beijing, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
CHENGDU BOE OPTOELETRONICS TECHNOLOGY CO., LTD., Chengdu, CN;
Abstract
The present disclosure relates to a via-hole connection structure and a method of manufacturing the same and an array substrate and a method of manufacturing the same. In an embodiment, a method of manufacturing a via-hole connection structure, includes the following steps of: forming a first conductive layer on a substrate, and patterning the first conductive layer to form a first conductive pattern on which a first photoresist pattern is provided; forming a first insulation layer covering the first conductive layer and the first photoresist pattern; patterning the first insulation layer to form a first via-hole from which at least a portion of the first photoresist pattern is exposed; removing the at least a portion of the first photoresist pattern exposed from the first via-hole; and forming a second conductive pattern, wherein the second conductive pattern is electrically connected to the first conductive pattern through the first via-hole.