The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2020
Filed:
Dec. 03, 2018
Universal Scientific Industrial (Shanghai) Co., Ltd., Shanghai, CN;
UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD., Shanghai, CN;
Abstract
A manufacturing method of a system in package (SiP) module based on double plastic-sealing, including: welding electronic units required by the SiP module onto a top surface of a Printed Circuit Board (PCB), with welding spots being reserved on a bottom surface of the PCB to obtain a PCB assembly (PCBA); implementing a first-time filling to fill on plastic materials on a top surface of the PCBA, ensuring that the plastic materials cover the electronic units, and obtaining a first-time plastic-sealing PCBA after the plastic materials are solidified; pasting tightly a functional film on a top surface of the first-time plastic-sealing PCBA to obtain a film-pasted PCBA; and implementing a second-time filling to fill on plastic materials on the film-pasted PCBA, ensuring that the plastic materials cover a top surface and a periphery of the film-pasted PCBA, and obtaining the SiP module after the plastic materials are solidified.