The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2020
Filed:
Jul. 12, 2018
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Min Jun Choi, Hwasung-si, KR;
Doo Won Kwon, Hwasung-si, KR;
Kwan Sik Kim, Hwasung-si, KR;
Tae Young Song, Hwasung-si, KR;
Sung Hyun Yoon, Hwasung-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/532 (2006.01); H01L 31/02 (2006.01); H01L 21/321 (2006.01); H01L 21/768 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 21/3212 (2013.01); H01L 21/76831 (2013.01); H01L 21/76898 (2013.01); H01L 23/5329 (2013.01); H01L 27/14636 (2013.01); H01L 31/02005 (2013.01);
Abstract
A semiconductor device including a via plug formed on a substrate and a metal layer for interconnection formed at an end of the via plug, wherein an insulating structure is under the metal layer for interconnection and the insulating structure has a different layered structure according to a positional relationship with the metal layer for interconnection is disclosed.