The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2020
Filed:
Aug. 28, 2018
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Yoshitaka Otsubo, Tokyo, JP;
Yoshitaka Kimura, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/492 (2006.01); H01L 23/04 (2006.01); H01L 23/24 (2006.01); H01L 23/10 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3736 (2013.01); H01L 23/04 (2013.01); H01L 23/10 (2013.01); H01L 23/24 (2013.01); H01L 23/3735 (2013.01); H01L 23/4926 (2013.01); H01L 23/49568 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/19107 (2013.01);
Abstract
A base plate includes a heat dissipation metal plate and a resin insulating layer. The resin insulating layer is formed on the heat dissipation metal plate. The resin insulating layer is provided with a notch where part of the heat dissipation metal plate is exposed. A case is bonded to an exposure part being part of the heat dissipation metal plate by means of a bonding agent.