The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2020
Filed:
Jun. 30, 2016
Applicant:
Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;
Inventors:
Yuji Takematsu, Kawasaki, JP;
Kenji Okamoto, Kawasaki, JP;
Assignee:
Fuji Electric Co., Ltd., , JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); B29K 63/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/295 (2013.01); H01L 23/296 (2013.01); H01L 23/3135 (2013.01); H01L 23/3142 (2013.01); H01L 23/562 (2013.01); B29K 2063/00 (2013.01); H01L 23/3121 (2013.01);
Abstract
Provided is a semiconductor device capable of self-repairing cracks or peels occurring in sealing materials. A semiconductor module includes a member including a semiconductor element, an insulating substrate bonded onto one surface of the semiconductor element, and a printed circuit board for coupling with an external circuit connected to the other surface of the semiconductor element, which are sealed with a sealing material. In the semiconductor module, the sealing material includes a first thermosetting resin and a microcapsule particle containing a second thermosetting resin precursor.