The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2020

Filed:

Jan. 27, 2014
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventor:

Kuang-Hui Tang, Kaohsiung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 22/34 (2013.01); H01L 22/32 (2013.01);
Abstract

A scribe line structure including a semiconductor substrate, a pad and a first patterned metal layer is provided. The semiconductor substrate has a die region, a die sealing region located outside the die region and a dicing region located outside the die sealing region. The pad is disposed in the dicing region. The first patterned metal layer is disposed in the dicing region, right below and connected to the pad, wherein the first patterned metal layer has a plurality of first patterns directly connected to each other.


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