The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2020

Filed:

Apr. 06, 2016
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Kuan-Ting Wu, Taipei, TW;

Ai-Tsung Li, Taipei, TW;

Ya-Ting Yeh, Taipei, TW;

Kevin Voss, Houston, TX (US);

Michael Delpier, Houston, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/10 (2006.01); G06F 1/20 (2006.01); B32B 33/00 (2006.01);
U.S. Cl.
CPC ...
G06F 1/203 (2013.01); B32B 33/00 (2013.01); G06F 2200/1633 (2013.01); Y10T 428/24802 (2015.01);
Abstract

Examples of a cover for a device are described herein. The cover includes a substrate to be placed in proximity of a heat source of a device. In an example, a heat resistant layer is applied over a surface of the substrate to insulate heat generated by the heat source. Further, a top layer is applied over one of the heat resistant layer and another surface of the substrate, which is opposite to the surface having the heat resistant layer. The top layer provides at least one of chemical resistant properties and aesthetic properties.


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