The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2020
Filed:
Jan. 30, 2015
Applicant:
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;
Inventors:
Assignee:
TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 9/18 (2006.01); F28F 7/02 (2006.01); F28F 21/04 (2006.01); F28D 7/10 (2006.01); F28D 21/00 (2006.01); C04B 37/02 (2006.01); F02B 29/04 (2006.01); C03C 8/24 (2006.01); C03C 3/06 (2006.01); C03C 8/02 (2006.01); C04B 35/565 (2006.01); C04B 35/66 (2006.01);
U.S. Cl.
CPC ...
F28F 9/185 (2013.01); C03C 3/06 (2013.01); C03C 8/02 (2013.01); C03C 8/24 (2013.01); C04B 35/565 (2013.01); C04B 35/66 (2013.01); C04B 37/02 (2013.01); F02B 29/0462 (2013.01); F28D 7/106 (2013.01); F28D 21/0003 (2013.01); F28F 7/02 (2013.01); F28F 21/04 (2013.01); C03C 2201/06 (2013.01); C03C 2207/02 (2013.01); C04B 2235/3826 (2013.01); C04B 2237/10 (2013.01); C04B 2237/125 (2013.01); C04B 2237/365 (2013.01); C04B 2237/406 (2013.01); C04B 2237/59 (2013.01); Y02T 10/146 (2013.01);
Abstract
A joint structure jointing a ceramic member and a metal member is a joint structure jointing a ceramic member and a metal member that are provided in a device provided on a portion through which gas passes. The joint structure has a joint portion that joints the ceramic member and the metal member. The joint portion includes a glass portion made of a glass and a metal solder portion having higher corrosion resistance with respect to the gas than the glass. An area where the metal solder portion contacts to the gas is larger than an area where the glass portion contacts to the gas.