The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2020
Filed:
Nov. 17, 2017
Applicant:
Hutchinson Technology Incorporated, Hutchinson, MN (US);
Inventors:
Douglas P. Riemer, Waconia, MN (US);
Kurt C. Swanson, Chippewa Falls, WI (US);
Peter F. Ladwig, Hutchinson, MN (US);
Assignee:
Hutchinson Technology Incorporated, Hutchinson, MN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); C25D 5/02 (2006.01); H05K 3/24 (2006.01); C25D 5/18 (2006.01); H05K 3/10 (2006.01); C25D 7/00 (2006.01);
U.S. Cl.
CPC ...
C25D 5/02 (2013.01); C25D 5/18 (2013.01); C25D 7/00 (2013.01); H05K 3/107 (2013.01); H05K 3/241 (2013.01); H05K 2203/0723 (2013.01); Y10T 428/24917 (2015.01);
Abstract
Devices including high-aspect ratio electroplated structures and methods of forming high-aspect ratio electroplated structures are described. A method for manufacturing metal structures includes providing a substrate having a metal base characterized by a height to width aspect ratio A/B and electroplating a metal crown on the base to form the metal structure with a height to width aspect ratio A/S greater than the aspect ratio A/B of the base.