The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2020

Filed:

Jan. 12, 2016
Applicants:

Jcu Corporation, Tokyo, JP;

Chuo Kikai Co., Ltd, Kyoto, JP;

Inventors:

Makoto Kohtoku, Kanagawa, JP;

Yaichiro Nakamaru, Kanagawa, JP;

Yukio Shinozaki, Kanagawa, JP;

Tetsuya Aoki, Tokyo, JP;

Takashi Matsukura, Tokyo, JP;

Goki Hashimoto, Kyoto, JP;

Assignees:

JCU CORPORATION, Tokyo, JP;

CHUO KIKAI CO., LTD, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/16 (2006.01); H05K 3/18 (2006.01); C23C 18/32 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C23C 18/1628 (2013.01); C23C 18/1632 (2013.01); H05K 3/187 (2013.01); H05K 999/99 (2013.01); C23C 18/32 (2013.01); H05K 1/0393 (2013.01); H05K 2201/0154 (2013.01); H05K 2203/0165 (2013.01); H05K 2203/072 (2013.01); H05K 2203/1545 (2013.01); H05K 2203/163 (2013.01);
Abstract

A wet type processing apparatus includes a processing bath for reserving inside the processing liquid and rendering the resin film pass through the processing liquid; a pair of conveyance members arranged on a loading side for the resin film of the processing bath and on a delivery side for resin film of the processing bath at a position higher than a liquid surface of the processing liquid reserved in the processing bath; and a spouting unit arranged between the pair of the conveyance members at a position lower than the conveyance members and formed with a circumferential surface having plural holes for spouting the processing liquid from the circumferential surface to change a direction of the resin film along the circumferential surface in a non-contact manner in the processing liquid according to spouted flows from the holes.


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