The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2020
Filed:
Jul. 26, 2017
Applicant:
Honda Motor Co., Ltd., Tokyo, JP;
Inventors:
Jianxun Hu, Dublin, OH (US);
Eric Walker, Dublin, OH (US);
Assignee:
Honda Motor Co., Ltd., Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 30/00 (2006.01); B23K 31/02 (2006.01); B23K 9/23 (2006.01); B23K 26/323 (2014.01); B23K 10/02 (2006.01); B23K 15/00 (2006.01); B23K 35/02 (2006.01); B23K 26/32 (2014.01); B23K 103/20 (2006.01); B23K 101/00 (2006.01); B23K 35/24 (2006.01);
U.S. Cl.
CPC ...
C22C 30/00 (2013.01); B23K 9/232 (2013.01); B23K 10/02 (2013.01); B23K 15/0093 (2013.01); B23K 26/323 (2015.10); B23K 31/02 (2013.01); B23K 35/0261 (2013.01); B23K 35/24 (2013.01); B23K 2101/006 (2018.08); B23K 2103/20 (2018.08);
Abstract
A multi-material component joined by a high entropy alloy is provided, as well as methods of making a multi-material component by joining dissimilar materials with high entropy alloys.