The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2020
Filed:
Sep. 09, 2015
Applicant:
Jiangsu University, Jiangsu, CN;
Inventors:
Assignee:
JIANGSU UNIVERSITY, , CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C21D 10/00 (2006.01); F01D 5/28 (2006.01); C21D 1/09 (2006.01);
U.S. Cl.
CPC ...
C21D 10/005 (2013.01); F01D 5/286 (2013.01); C21D 1/09 (2013.01); C21D 10/00 (2013.01); C21D 2221/00 (2013.01); F05D 2230/90 (2013.01); F05D 2300/516 (2013.01);
Abstract
A method for laser shock peening (LSP) to uniformly strengthen metallic components uses varied square-spot LSP with stagger multiple-layer. Each layer is subjected to square-spot LSP treatment, without overlapping. The length of square-spot in the first layer is larger than those in the second layer and third layers, and the length of square-spot in the second layer is equal to that in the third layer. The first layer treated by LSP is used to reduce deeper localized compressive residual stress, and the second and third layers imparted by square-spot LSP with staggered distance are used to eliminate of the boundary effect and decrease surface roughness.