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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10640840 B1

PDFFull Text
Date of Patent:
May. 05, 2020

Filed:

Aug. 29, 2016

Hot press formed article having excellent delamination resistance and method for manufacturing the same

Applicant:

Posco, Pohang-si, KR;

Inventors:

Heung-Yun Kim, Gwangyang-si, KR;

Il-Ryoung Sohn, Gwangyang-si, KR;

Dae-Chul Bae, Pohang-si, KR;

Assignee:

POSCO, Pohang-si, KR;

Attorney:

Cantor Colburn LLP

Primary Examiner:

Adam Krupicka

Int. Cl.
CPC ...
B32B 15/01 (2006.01); C21D 9/46 (2006.01); C23C 2/12 (2006.01); C23C 2/28 (2006.01); C23C 30/00 (2006.01); C23C 2/02 (2006.01); C22C 38/28 (2006.01); C21D 8/02 (2006.01); C22C 21/02 (2006.01); C22C 38/00 (2006.01); C22C 38/02 (2006.01); C22C 38/04 (2006.01); C22C 38/06 (2006.01); C22C 38/32 (2006.01); C22F 1/043 (2006.01); C23C 2/40 (2006.01);
U.S. Cl.
CPC ...
C21D 9/46 (2013.01); B32B 15/012 (2013.01); C21D 8/0226 (2013.01); C21D 8/0236 (2013.01); C22C 21/02 (2013.01); C22C 38/001 (2013.01); C22C 38/002 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/06 (2013.01); C22C 38/28 (2013.01); C22C 38/32 (2013.01); C22F 1/043 (2013.01); C23C 2/02 (2013.01); C23C 2/12 (2013.01); C23C 2/28 (2013.01); C23C 2/285 (2013.01); C23C 2/40 (2013.01); C23C 30/00 (2013.01);
Abstract

An HPF molding member having a melted aluminum plating layer formed on the surface of a base steel sheet and excellent delamination resistance. The base steel sheet comprises: 0.18-0.25% by weight of C; 0.1-1.0% by weight of Si; 0.9-1.5% by weight of Mn; 0.03% by weight or less of P; 0.01% by weight or less of S; 0.01-0.05% by weight of Al; 0.05-0.5% by weight of Cr; 0.01-0.05% by weight of Ti; 0.001-0.005% by weight of B; 0.009% by weight or less of N; and the balance Fe and other impurities. The plating layer consists of a soft diffusion layer and a hard alloy layer, the hard alloy layer having a tau layer irregularly and non-continuously dispersed and distributed on the inside thereof at 10% or more of the entire area fraction. The difference in hardness between the alloy layer and the diffusion layer is 400 (Hv) or less.

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