The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2020
Filed:
Feb. 14, 2018
Dunan Microstaq, Inc., Austin, TX (US);
Wayne C. Long, Austin, TX (US);
Joseph L. Nguyen, Austin, TX (US);
Dunan Microstaq, Inc., Austin, TX (US);
Abstract
A method of attaching a MEMS die to a base includes selecting an attachment material (x), determining a maximum acceptable change in pressure due to mounting stress (dPtarget) transmitted to a MEMS die, determining a worst-case pressure difference transfer function of the attachment material (x) over a thickness (h) variation of the attachment material (x) using the equation: dPmax=h*B+C, wherein B=pressure variation/thickness (h), and C=pressure variation, substituting dPtarget for dPmaxin the pressure difference transfer function and solving the equation for h, wherein h=(dPtarget−C)/B, and attaching the MEMS die to a base using the selected attachment material (x) having at least the calculated thickness (h).