The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2020

Filed:

Nov. 17, 2014
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Hang Yan Yuen, Fort Collins, CO (US);

Hui He, Fort Collins, CO (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/12 (2006.01); B32B 5/16 (2006.01); B32B 5/28 (2006.01); B32B 27/34 (2006.01); B32B 5/02 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B32B 5/22 (2006.01); B32B 5/30 (2006.01);
U.S. Cl.
CPC ...
B32B 27/12 (2013.01); B32B 5/02 (2013.01); B32B 5/024 (2013.01); B32B 5/16 (2013.01); B32B 5/22 (2013.01); B32B 5/28 (2013.01); B32B 5/30 (2013.01); B32B 27/304 (2013.01); B32B 27/322 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/0269 (2013.01); B32B 2262/101 (2013.01); B32B 2262/103 (2013.01); B32B 2262/106 (2013.01); B32B 2264/0257 (2013.01); B32B 2307/50 (2013.01); B32B 2307/51 (2013.01); B32B 2307/546 (2013.01); B32B 2307/706 (2013.01); B32B 2307/72 (2013.01); B32B 2307/724 (2013.01); B32B 2307/7265 (2013.01); B32B 2457/00 (2013.01);
Abstract

Provided in one example is a composite. The composite includes: a porous core layer including a fluoropolymer; a first layer disposed over at least a portion of the core layer; and a second layer disposed over at least a portion of the first layer. The first layer includes fibers that compose at least one of unidirectional fibers and woven fibers. The second layer includes a polymer. The composite is permeable to air but impermeable to liquid wafer.


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