The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2020
Filed:
Mar. 03, 2015
Applicant:
Sekisui Chemical Co., Ltd., Osaka, Osaka, JP;
Inventor:
Shigekatsu Ohnishi, Osaka, JP;
Assignee:
SEKISUI CHEMICAL CO., LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/02 (2006.01); C09D 5/24 (2006.01); C08K 9/00 (2006.01); B22F 1/02 (2006.01); B22F 1/00 (2006.01); B22F 9/08 (2006.01); B22F 9/16 (2006.01); C09C 1/62 (2006.01); C09C 1/66 (2006.01); C09D 5/26 (2006.01); C09D 161/06 (2006.01); C09K 5/14 (2006.01); C22F 1/08 (2006.01); C23C 8/20 (2006.01); C23C 16/26 (2006.01); C23C 16/44 (2006.01); C23C 16/56 (2006.01); C08K 9/02 (2006.01);
U.S. Cl.
CPC ...
B22F 1/02 (2013.01); B22F 1/0014 (2013.01); B22F 1/0018 (2013.01); B22F 1/0059 (2013.01); B22F 1/0085 (2013.01); B22F 1/025 (2013.01); B22F 9/082 (2013.01); B22F 9/16 (2013.01); C09C 1/627 (2013.01); C09C 1/66 (2013.01); C09D 5/24 (2013.01); C09D 5/26 (2013.01); C09D 161/06 (2013.01); C09K 5/14 (2013.01); C22F 1/08 (2013.01); C23C 8/20 (2013.01); C23C 16/26 (2013.01); C23C 16/4417 (2013.01); C23C 16/56 (2013.01); H01B 1/02 (2013.01); B22F 2201/10 (2013.01); B22F 2201/30 (2013.01); B22F 2301/10 (2013.01); B22F 2302/10 (2013.01); B22F 2302/25 (2013.01); B22F 2302/45 (2013.01); B22F 2304/054 (2013.01); B22F 2304/10 (2013.01); B22F 2998/10 (2013.01); C08K 9/02 (2013.01); C08K 2201/001 (2013.01); C08K 2201/003 (2013.01); C08K 2201/005 (2013.01); C08K 2201/011 (2013.01);
Abstract
There is provided conductive paste excellent in electro-conductivity and thermal conductivity. Conductive paste comprising conductive filler being composite particles including copper powder and nanosize precipitates which are disposed on the surface of the copper powder and composed of at least one kind of transition metal belonging to the group 8 to group 10 of the periodic table or a compound of the transition metal, and a binder resin.
Ohnishi, Shigekatsu. (2020). Conductive filler, method for manufacturing conductive filler, and conductive paste (U.S. Patent No. 10639713). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10639713
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile