The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2020

Filed:

Jul. 25, 2017
Applicant:

Olympus Corporation, Tokyo, JP;

Inventors:

Yutaka Shirota, Hino, JP;

Masaaki Watanabe, Hachioji, JP;

Assignee:

OLYPMUS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 1/00 (2006.01); A61B 1/12 (2006.01); A61B 1/06 (2006.01); G02B 23/26 (2006.01); G02B 7/00 (2006.01); G02B 27/14 (2006.01); G02B 23/24 (2006.01);
U.S. Cl.
CPC ...
A61B 1/128 (2013.01); A61B 1/00117 (2013.01); A61B 1/00126 (2013.01); A61B 1/06 (2013.01); A61B 1/0669 (2013.01); A61B 1/0684 (2013.01); G02B 7/008 (2013.01); G02B 23/2469 (2013.01); G02B 23/26 (2013.01); G02B 27/145 (2013.01);
Abstract

The cooling unit includes: an opening part through which the cooling media flow in; a first flow path; a second flow path; a first heat generation section; a second heat generation section; a first heat dissipation section that is thermally connected to the first heat generation section, and is disposed in the first flow path; and a second heat dissipation section that is thermally connected to the second heat generation section, and is disposed in the second flow path. The second flow path is disposed between the first and second heat generation sections and the first flow path, and the first heat dissipation section has a thermal resistance value smaller than a thermal resistance value of the second heat dissipation section.


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