The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2020

Filed:

Jul. 12, 2018
Applicant:

Delta Electronics (Shanghai) Co., Ltd., Shanghai, CN;

Inventors:

Wei Guo, Shanghai, CN;

Peiai You, Shanghai, CN;

Hao Sun, Shanghai, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H02M 7/00 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); H02M 7/003 (2013.01); H05K 1/0203 (2013.01); H05K 1/184 (2013.01); H05K 7/2049 (2013.01); H05K 7/2089 (2013.01); H05K 7/20436 (2013.01); H05K 7/20927 (2013.01); H05K 2201/10393 (2013.01); H05K 2201/10409 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10757 (2013.01);
Abstract

The present disclosure provides a power module assembly and an assembling method thereof. The power module assembly includes a housing, a circuit board, at least one resilient set, at least two power devices, and at least one fastening unit. The housing includes at least one heat-dissipation surface. The at least one resilient set is disposed between the housing and the circuit board and includes at least one resilient piece. Each resilient piece includes a base section and two pushing fingers, so as to form an M-word shape or a bird-wings shape. The fastening unit is disposed between the two power devices, connected to the base section of the resilient piece and configured to drive the base section of the resilient piece, so that the two pushing fingers of the resilient piece push against the two power devices respectively and the two power devices are attached to the heat-dissipation surface.


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