The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2020

Filed:

Apr. 05, 2017
Applicant:

Zkw Group Gmbh, Wieselburg, AT;

Inventors:

Erik Edlinger, Vienna, AT;

Dietmar Kieslinger, Theresienfeld, AT;

Emanuel Weber, Baden, AT;

Assignee:

ZKW GROUP GMBH, Wieselburg, AT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/467 (2006.01); F21S 45/49 (2018.01); F21S 45/47 (2018.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20127 (2013.01); F21S 45/47 (2018.01); F21S 45/49 (2018.01); H01L 23/467 (2013.01); H05K 1/0206 (2013.01); H05K 1/181 (2013.01); H05K 7/20145 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10257 (2013.01);
Abstract

A component cooling device () comprising: a circuit board (), the circuit board () having an upper side () and a lower side () facing away from the upper side (); and at least one electronic component () and at least one hollow circuit board opening () for a gaseous cooling medium for cooling the component, wherein on the lower side () of the circuit board () is provided a guide () which forms a flow channel () that has at least one inlet () and at least one outlet, which is formed by the at least one circuit board opening (), for at least one convection flow () of the cooling medium.


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