The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2020

Filed:

Oct. 17, 2018
Applicant:

Merry Electronics(shenzhen) Co., Ltd., ShenZhen, CN;

Inventors:

Jen-Yi Chen, Taichung, TW;

Chao-Sen Chang, Taichung, TW;

Kai-Yu Jiang, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 25/00 (2006.01); H04R 17/00 (2006.01); B81B 3/00 (2006.01); B81B 7/02 (2006.01); B81B 7/04 (2006.01); H04R 19/02 (2006.01);
U.S. Cl.
CPC ...
H04R 17/005 (2013.01); B81B 3/0018 (2013.01); B81B 7/02 (2013.01); B81B 7/04 (2013.01); H04R 19/02 (2013.01); H04R 2201/003 (2013.01);
Abstract

A MEMS speaker including a base, a circuit board, a spacing layer, a vibration mold, and at least one actuator. The base has a first chamber. The circuit board is disposed on the base, and has at least one support portion and a fixing portion disposed around the support portion. The at least one support portion has a first perforation, and a plurality of second perforations are formed between the at least one support portion and the fixing portion. The spacing layer is disposed on the circuit board. A second chamber is formed between the spacing layer and the circuit board. The vibration mold is disposed on the spacing layer. The actuator is disposed on the support portion of the circuit board. The actuator has a shift part and a deformation part disposed above the first perforation of the support portion. The second perforations communicate with the first chamber and the second chamber.


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