The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2020

Filed:

Jan. 03, 2019
Applicant:

Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;

Inventor:

Ikuo Soga, Isehara, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/195 (2006.01); H03F 1/56 (2006.01); H03F 3/19 (2006.01); H03F 1/02 (2006.01); H05K 1/02 (2006.01); H01P 3/08 (2006.01); H05K 1/14 (2006.01); H03F 3/24 (2006.01); H03F 3/60 (2006.01);
U.S. Cl.
CPC ...
H03F 1/56 (2013.01); H01P 3/08 (2013.01); H03F 1/0205 (2013.01); H03F 3/19 (2013.01); H03F 3/245 (2013.01); H03F 3/601 (2013.01); H05K 1/0243 (2013.01); H05K 1/144 (2013.01); H03F 2200/387 (2013.01); H03F 2200/451 (2013.01); H05K 2201/041 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10378 (2013.01);
Abstract

An amplification device includes a base metallic plate at a ground potential, an amplifier disposed on the base metallic plate, and including a plurality of transistors, and a matcher disposed on the base metallic plate so as to be coupled to the amplifier, the matcher performing impedance matching of output of the amplifier, wherein the matcher includes a first matching circuit board including a first dielectric board disposed on an upper surface of the base metallic plate, the first dielectric board having, on an upper surface, a transmission line coupled to an output electrode of the amplifier, and a second matching circuit board disposed so as to intersect the first matching circuit board, and disposed with a second dielectric board sandwiched by a first metallic film having one end coupled to the transmission line and having another end opened and a second metallic film at the ground potential.


Find Patent Forward Citations

Quick Actions:

Soga, Ikuo. (2020). Amplification device and electromagnetic wave irradiating device (U.S. Patent No. 10637410). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10637410

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…