The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2020

Filed:

Jul. 28, 2016
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Fumio Shohda, Tokyo, JP;

Yojiro Watanabe, Tokyo, JP;

Takayuki Yanagisawa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 3/06 (2006.01); H01S 3/063 (2006.01); H01S 3/16 (2006.01);
U.S. Cl.
CPC ...
H01S 3/0621 (2013.01); H01S 3/063 (2013.01); H01S 3/0612 (2013.01); H01S 3/0615 (2013.01); H01S 3/0625 (2013.01); H01S 3/0632 (2013.01); H01S 3/1608 (2013.01); H01S 3/1611 (2013.01); H01S 3/1618 (2013.01);
Abstract

In a planar waveguide laser device (), a substrate () is joined to the upper surface of a waveguide (). A recess () having a chamfered shape is formed along an edge of an end facet of the substrate () on the side of the waveguide (), the end facet being perpendicular to the direction of laser oscillation. An end facet of the waveguide () perpendicular to the oscillation direction of laser light is covered with a coating (). A wraparound portion () continuing from the coating () covers the upper surface of the waveguide () facing the recess () of the substrate ().


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