The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2020
Filed:
Nov. 24, 2017
Applicant:
Fuji Electric Co., Ltd., Kanagawa, JP;
Inventor:
Shin Soyano, Shiojiri, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/58 (2011.01); H05K 3/28 (2006.01); H01R 4/70 (2006.01); H01R 43/18 (2006.01); H01R 43/20 (2006.01); H05K 1/14 (2006.01); H01L 25/11 (2006.01); H01R 13/41 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/07 (2006.01); H05K 3/00 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H01R 12/585 (2013.01); H01R 4/70 (2013.01); H01R 43/18 (2013.01); H01R 43/205 (2013.01); H05K 1/142 (2013.01); H05K 3/28 (2013.01); H01L 23/49811 (2013.01); H01L 23/5383 (2013.01); H01L 25/072 (2013.01); H01L 25/115 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01R 12/58 (2013.01); H01R 13/41 (2013.01); H05K 3/0014 (2013.01); H05K 3/4015 (2013.01); H05K 2201/09118 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10303 (2013.01); H05K 2201/10424 (2013.01); H05K 2201/10522 (2013.01); H05K 2203/1327 (2013.01);
Abstract
A semiconductor device is provided, in order to prevent tilt of a terminal pin in the semiconductor device with a printed board in which the terminal pin is pressed, the semiconductor device comprising a printed board, a plurality of pins pressed in the printed board, a resin block in which a plurality of through holes are formed, the plurality of pins respectively pressed in the plurality of through holes, and a resin case covering at least a part of the printed board and the resin block.