The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2020

Filed:

Oct. 04, 2017
Applicant:

Inpaq Technology Co., Ltd., Miaoli County, TW;

Inventors:

Ta-Fu Cheng, Miaoli County, TW;

Chih-Ming Su, Taipei, TW;

Assignee:

INPAQ TECHNOLOGY CO., LTD., Miaoli County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 9/04 (2006.01); H01Q 1/22 (2006.01); H01Q 5/40 (2015.01); H01Q 21/28 (2006.01); H01L 23/64 (2006.01); H01L 25/065 (2006.01); H01L 23/66 (2006.01); H01Q 5/35 (2015.01);
U.S. Cl.
CPC ...
H01Q 9/0414 (2013.01); H01L 23/64 (2013.01); H01L 23/66 (2013.01); H01L 25/0657 (2013.01); H01Q 1/2283 (2013.01); H01Q 5/40 (2015.01); H01Q 9/045 (2013.01); H01Q 21/28 (2013.01); H01L 2223/6677 (2013.01); H01Q 5/35 (2015.01);
Abstract

The present invention provides a portable electronic device and a stacked antenna module thereof. The stacked antenna module includes a first antenna structure and a second antenna structure stacked on the first antenna structure and insulated from the first antenna structure. The first antenna structure includes a first carrier substrate having at least one through hole, a surrounding insulation layer disposed inside the at least one through hole, and a first feeding pin passing through the first carrier substrate. The second antenna structure includes a second carrier substrate and a second feeding pin passing through the second carrier substrate, and the second feeding pin passes through the surrounding insulation layer without contacting the surrounding insulation layer.


Find Patent Forward Citations

Loading…