The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2020

Filed:

Jul. 09, 2019
Applicant:

Applied Optoelectronics, Inc., Sugar Land, TX (US);

Inventors:

I-Lung Ho, Sugar Land, TX (US);

Qin Li, Houston, TX (US);

Chong Wang, Stafford, TX (US);

Assignee:

Applied Optoelectronics, Inc., Sugar Land, TX (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/00 (2013.01); H01L 35/32 (2006.01); H04B 10/50 (2013.01); H01S 5/068 (2006.01); F25B 21/02 (2006.01); H04J 14/00 (2006.01);
U.S. Cl.
CPC ...
H01L 35/32 (2013.01); F25B 21/02 (2013.01); H01S 5/06804 (2013.01); H04B 10/501 (2013.01);
Abstract

In general, the present disclosure is directed to a thermoelectric cooler (TEC) that includes a top plate or bottom plate being formed of a high thermal conductivity material, and the other of the top plate and bottom plate being formed of a low thermal conductivity material, with the high thermal conductivity material having a thermal conductivity at least twice, and preferably five times, that of the thermal conductivity of the low thermal conductivity material. This disparity in thermal conductivity between the top plate and bottom plate materials may be referred to herein as asymmetric thermal performance.


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