The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2020

Filed:

Jan. 08, 2016
Applicant:

Asahi FR R&d Co., Ltd., Saitama-shi, Saitama, JP;

Inventors:

Kazuhisa Takagi, Saitama, JP;

Koichi Abe, Saitama, JP;

Nobuyoshi Watanabe, Saitama, JP;

Syuhei Toyoshima, Saitama, JP;

Assignee:

ASAHI FR R&D CO., LTD., Saitama-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 35/32 (2006.01); B32B 25/20 (2006.01); H01L 35/08 (2006.01); B32B 27/18 (2006.01); B32B 27/20 (2006.01); B60H 1/00 (2006.01); H01L 35/30 (2006.01);
U.S. Cl.
CPC ...
H01L 35/32 (2013.01); B32B 25/20 (2013.01); B32B 27/18 (2013.01); B32B 27/20 (2013.01); B60H 1/00478 (2013.01); H01L 35/08 (2013.01); B32B 2307/302 (2013.01); H01L 35/30 (2013.01);
Abstract

A flexible Peltier device in which emitting heat conversion properties between Peltier elements and an object transferring heat may be improved and a flexible heat-emitting sheet having the Peltier elements bonded thereto may be bent without worrying the separation there between. A flexible Peltier device includes a single or plural Peltier element which is disposed on one surface side of a heat-emitting sheet having flexibility made from heat-conductive rubber containing a heat conductive filler and each semiconductor element which has a heating side and a cooling side and composes the Peltier element at least one of the heating side and the cooling side is bonded integrally to the heat-emitting sheet by a direct covalent bond and/or by an indirect covalent bond through a molecular adhesive at active groups existing on each other surfaces.


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