The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2020

Filed:

Sep. 05, 2018
Applicant:

Asti Global Inc., Taiwan, Changhua County, TW;

Inventor:

Chien-Shou Liao, New Taipei, TW;

Assignee:

ASTI GLOBAL INC., Changhua County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/52 (2010.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0095 (2013.01); H01L 25/0753 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method for manufacturing a light-emitting module includes: firstly, attaching a semiconductor structure on a first supporting substrate, the semiconductor structure including a bottom layer and a plurality of light-emitting chips disposed on the bottom layer; next, separating the bottom layer from the semiconductor structure, the light-emitting chips being borne on the first supporting substrate; then, attaching the first supporting substrate with the light-emitting chips on a second supporting substrate; subsequently, separating the first supporting substrate from each light-emitting chip, each light-emitting chip having at least two lands exposed to exterior; next, separating each light-emitting chip from the second supporting substrate; and then disposing each light-emitting chip on a circuit board. Therefore, the light-emitting module is finished by the above-mentioned steps.


Find Patent Forward Citations

Liao, Chien-Shou. (2020). Method for manufacturing light-emitting module (U.S. Patent No. 10636937). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10636937

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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