The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2020

Filed:

Sep. 20, 2016
Applicant:

Centrotherm International Ag, Blaubeuren, DE;

Inventors:

Thomas Pernau, Blaubeuren, DE;

Peter Völk, Griesingen, DE;

Hans-Peter Elser, Ulm, DE;

Wolfgang Scheiffele, Erbach, DE;

Andreas Reichart, Berghülen, DE;

Olaf Romer, Leipzig, DE;

Wolfgang Jooss, Constance, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/18 (2006.01); H01L 21/67 (2006.01); H01L 21/322 (2006.01);
U.S. Cl.
CPC ...
H01L 31/1868 (2013.01); H01L 21/3221 (2013.01); H01L 21/67109 (2013.01); H01L 21/67115 (2013.01); H01L 21/67173 (2013.01); H01L 31/1876 (2013.01); Y02E 10/50 (2013.01); Y02P 70/521 (2015.11);
Abstract

The invention relates to methods and an apparatus for passivating defects of a semiconductor substrate, in particular a silicon based solar cell. According to the method, the substrate is irradiated with electromagnetic radiation during a first process phase, wherein the radiation directed onto the substrate has wavelengths at least in the region below 1200 nm and an intensity of at least 8000 Watt/m2. This can lead to a heating of the substrate, or a temperature control can be provided. Subsequently, the substrate is irradiated with electromagnetic radiation during a temperature-holding phase following the first process phase, wherein the radiation directed onto the substrate has wavelengths primarily in the region below 1200 nm and an intensity of at least 8000 Watt/m2, while a side of the substrate facing away from a source of the electromagnetic radiation is cooled via a contact with a support cooled by a cooling device.


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