The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2020

Filed:

Nov. 01, 2016
Applicant:

Starkey Laboratories, Inc., Eden Prairie, MN (US);

Inventors:

Sayed Kaysarbin Rahim, Chaska, MN (US);

Douglas F. Link, Plymouth, MN (US);

Susan Marie Johansson, Eden Prairie, MN (US);

Assignee:

Starkey Laboratories, Inc., Eden Prairie, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H01L 25/18 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 23/538 (2006.01); H01L 29/06 (2006.01); H01L 23/50 (2006.01); H04R 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/6835 (2013.01); H01L 23/4985 (2013.01); H01L 23/5387 (2013.01); H01L 23/5389 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 24/94 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 23/50 (2013.01); H01L 24/29 (2013.01); H01L 24/48 (2013.01); H01L 24/83 (2013.01); H01L 29/0657 (2013.01); H01L 2221/68345 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32105 (2013.01); H01L 2224/32106 (2013.01); H01L 2224/32111 (2013.01); H01L 2224/32147 (2013.01); H01L 2224/4811 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83868 (2013.01); H01L 2224/83871 (2013.01); H01L 2224/83874 (2013.01); H01L 2224/92 (2013.01); H01L 2224/92242 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/94 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06558 (2013.01); H01L 2225/06568 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10158 (2013.01); H01L 2924/15156 (2013.01); H04R 25/60 (2013.01);
Abstract

Various embodiments of an integrated circuit module and a method of forming such module are disclosed. The module includes a first die having an active substrate, an integrated circuit disposed on a first major surface of the active substrate, and a cavity disposed in a second major surface of the active substrate. The module also includes a second die having a first major surface, a second major surface, and a conductive pad disposed on the second major surface. The second die is disposed at least partially within the cavity of the first die such that the first major surface of the second die faces the cavity of the first die.


Find Patent Forward Citations

Rahim, Sayed. (2020). Integrated circuit module and method of forming same (U.S. Patent No. 10636768). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10636768

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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