The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2020
Filed:
Dec. 03, 2018
Hannstar Display Corporation, Taipei, TW;
Hsuan-Chen Liu, Kaohsiung, TW;
Yu-Tuan Hsu, Taichung, TW;
HANNSTAR DISPLAY CORPORATION, Taipei, TW;
Abstract
An electronic product includes a substrate and a bonding pad structure. The bonding pad structure is disposed on the substrate, and the bonding pad structure includes a first metal layer, a first insulating layer, at least one first connecting hole and a transparent conductive layer. The first metal layer and the first insulating layer are disposed on the substrate. The first connecting hole is situated in the first insulating layer, and the first connecting hole exposes a portion of the first metal layer. The transparent conductive layer is disposed on the first insulating layer, and the transparent conductive layer has a first edge and a second edge opposite to the first edge, wherein the transparent conductive layer is electrically connected to the first metal layer through the first connecting hole. A spacing between the first edge and the first connecting hole is greater than or equal to 100 μm.