The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2020
Filed:
Jan. 22, 2019
Applicant:
Fuji Electric Co., Ltd., Kawasaki-shi, JP;
Inventor:
Takashi Shimada, Matsumoto, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/82 (2006.01); H01L 21/02 (2006.01); H01L 21/304 (2006.01); H01L 29/16 (2006.01); H01L 21/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/8213 (2013.01); H01L 21/02378 (2013.01); H01L 21/3043 (2013.01); H01L 29/1608 (2013.01); H01L 21/0485 (2013.01); H01L 21/0495 (2013.01);
Abstract
Along dicing lines, cutting grooves that reach a rear surface from a front surface are formed by a first dicing blade in a semiconductor wafer, completely separating the semiconductor wafer into individual semiconductor chips by the cutting grooves. Thereafter, by a second dicing blade that is constituted by abrasive grains having a mean grit size smaller than that of the first dicing blade and that has a blade width wider than that of the first dicing blade, side walls of the cutting grooves, i.e., side surfaces of the semiconductor chips are polished, approaching a specular state.